发明名称 MANUFACTURE OF HIGH-DENSITY MULTI-LAYER PRINTED WIRING BOARD
摘要 PURPOSE:To improve working efficiency in a lamination press process by controlling interlaminar positional deviation of a base material, by making use of a stud made of a soft metal or heat-resistant resin as a pin for pin lamination at the time of lamination press. CONSTITUTION:A guide hole for pin lamination is bored into a copper plated laminated board 8 and also a through hole for a stud is bored at the same time. Then an inner layer circuit is formed and copper oxide treatment is performed. Then an inner layer circuit layer is fixed with the stud 7 made of either a softer metal as compared with SUB or heat-resistant resin through prepreg. In this instance, the stud 7 is buried into a part where there is no inner layer copper foil on the inside of a product or that outside of the product. Lamination press is performed by standing up pins 1 for pin lamination around the board further. Boring of an outer layer, smear treatment, deburring, honing, chemical copper plating and electroplating with copper are performed continuously. The used stud 7 is left behind within the product without performing etching at a point of time of formation of an outer layer circuit.
申请公布号 JPH01192513(A) 申请公布日期 1989.08.02
申请号 JP19880018129 申请日期 1988.01.28
申请人 HITACHI CHEM CO LTD 发明人 KAWASHIMA YUTAKA
分类号 B29C43/20;B29K105/06;B29L9/00;B29L31/34;H05K3/46 主分类号 B29C43/20
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