发明名称 THIN FILM TRANSISTOR ARRAY SUBSTRATE
摘要 <p>PURPOSE:To facilitate manufacture by decreasing the number of inter-layer insulation films and to improve the surface flatness by forming a gate electrode wiring and an accumulation capacitor electrode on one and the same plane and forming a wiring part by the two-layer structure of a gate electrode member and a transparent conductive film. CONSTITUTION:By forming a transparent conductive film on a transparent glass substrate 1 and patterning it, a gate electrode 2 and a capacitor electrode 3 are formed. Subsequently, Cr is formed to a film and by patterning it, a gate electrode 4 and a capacitor electrode 5 are overlapped and formed on the gate electrode wiring 2 and the capacitor electrode 3, respectively. The electrode 4 and 5 are connected by an upper layer wiring 7 at the time of forming a transistor thereafter. Next, a gate insulating film 11 for covering the wiring 4 and the electrode 5 is formed. On a gate insulating film 11 on the wiring 4, a-Si 8 is formed, an opening hole 6 is provided on the insulating film 11 on the capacitor electrode 5, and thereafter, the upper layer wiring is formed. This upper layer wiring becomes the wiring 7 for connecting the capacitor electrode in the line direction together with a source electrode 9 and a drain electrode 9' of the transistor. The electrode 5 is connected to a ground terminal of the substrate 1 by the wiring 7, and a display electrode 10 is provided.</p>
申请公布号 JPH01191830(A) 申请公布日期 1989.08.01
申请号 JP19880017900 申请日期 1988.01.27
申请人 NEC CORP 发明人 SUKEGAWA OSAMU
分类号 H01L27/12;G02F1/133;G02F1/136;G02F1/1368;H01L21/336;H01L29/78;H01L29/786 主分类号 H01L27/12
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