发明名称 MANUFACTURE OF SEMICONDUCTOR SUBSTRATE
摘要 PURPOSE:To omit the dividing work of substrates in manufacturing solar cell elements and to simplify steps for obtaining modules, by inserting partitioning members comprising heat resisting insulating material in a crucible beforehand when a semiconductor material is solidified, solidifying the material together with the partitioning members, and cutting the material together with the partitioning member in plate shapes. CONSTITUTION:Patitioning members 2 having a plurality of partitioned spaces are inserted into a crucible 1. When a semiconductor material comprises Si, quartz, alumina or the like is used as the partioning members 2. Then, a melted semiconductor material 3 is poured into the crucible 1. The material 3 is cooled and solidified with the partitioning members 2 being inserted. A solidified ingot 4 is taken out of the crucible 1. Semiconductor substrates 5 having a specified thickness are cut out. The substrate is partitioned into a plurality of parts 51 with the partioning members 2. The number and shapes of the parts 51 can be arbitrarily selected. In the process for implementing solar cell elements, the substrates 5 are processed in the same steps as in the manufacture of one solar cell element regardless of the shape of the partitioning member 2. Thus, P-N junction can be formed, and a plurality of the elements can be manufactured at the same time.
申请公布号 JPH01191482(A) 申请公布日期 1989.08.01
申请号 JP19880016390 申请日期 1988.01.27
申请人 SHARP CORP 发明人 SHIBUYA NORIAKI
分类号 H01L21/208;H01L31/04 主分类号 H01L21/208
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