| 摘要 |
<p>PURPOSE:To enable the mass production of semiconductor elements of high reliability by employing an internal lead member having collar part at one end, thereby eliminating the hang of a solder. CONSTITUTION:A semiconductor chip (a diode chip or the like) 5 is disposed through a solder piece 7 on a conductive substrate 1. A metal piece 6 is disposed through a solder piece 10 on an external lead member 2. One end 11a of a bar-shaped internal lead member 11 is disposed through a solder piece 8 on the chip 5, and the other end 11b is disposed through a solder piece 9 on the piece 6. At this time, the member 11 is held horizontally. Thereafter, they are filled in a heating furnace, the solder piece is simultaneously melted, and connected between them via the solders 7a-10a. In this case, the member 11 has a collar part 14 at least at one end, and the part 14 is disposed at the center on the upper surface isolated from the edge of the upper surface of the chip 5.</p> |
