| 摘要 |
PURPOSE:To miniaturize the structure of a semiconductor resistor as much as possible by forming the semiconductor resistor extending over the rear from the surface of a semiconductor substrate and respectively providing electrodes onto the surface and rear of the semiconductor substrate. CONSTITUTION:A semiconductor resistor 2 is shaped extending over the rear from the surface of a semiconductor substrate 1, and electrodes 3 are formed on both surface sides of the semiconductor substrate 1 in the semiconductor resistor 2. The semiconductor resistor 2 designed so as to acquire a resistance value between the surface and rear of the semiconductor substrate 1 is shaped to the substrate 11 through an ion implantation method, etc., and the electrodes 3 are formed respectively on the substrate surface side and substrate rear side of the semiconductor resistor 2. The electrode 3 shaped on the rear side of the semiconductor substrate 1 is connected electrically to a grounding metallic layer 4 coating the whole rear of the semiconductor substrate 1. Accordingly, a through-hole in the semiconductor substrate formed for grounding one electrode for the semiconductor resistor to a ground and a pad for gold wire bonding are unnecessitated, thus miniaturizing circuit constitution, then improving the degree of freedom of pattern arrangement. |
