VERFAHREN ZUR HERSTELLUNG VON ELEKTRISCHEN LEITERPLATTEN

摘要

Circuit boards with conductor tracks having good adhesion are obtained by chemically or mechanically removing the cladding from the substrate boards which are clad with copper foil on both sides, activating and, optionally, sensitising them, providing them with a 0.05-2.0 mu m thick layer composed of nickel, cobalt, manganese, or a nickel/iron or nickel/cobalt mixture in an electroless metallisation bath, applying a 0.5-5.0 mu m thick copper layer in a subsequent copper bath and building up the conductor pattern thereon by standard semi-additive methods.