| 摘要 |
PURPOSE:To obtain a low-cost semiconductor device having high productivity by mounting an addition circuit affixed to an integrated circuit chip and the integrated circuit chip onto one sub-carrier and mounting a plurality of the sub-carriers to a single semiconductor vessel. CONSTITUTION:Integrated circuit chips 4 and addition circuits 5 affixed to the integrated circuit chips 4 are mounted onto one sub-carrier 6, and a plurality of the sub-carriers 6 are mounted into a single semiconductor vessel 2. A part in which the film circuit substrate 5 consisting of an alumina substrate, to which one MMIC chip 4 composed of gallium arsenide and the addition circuit annexed to the chip 4 are shaped, is bonded onto the sub-carrier 6, in which a sintered alloy made up of copper and tungsten is plated with gold, by adhesives consisting of a gold tin alloy is used as one unit, and a plurality of the sub-carriers 6 are bonded onto the mounting surface 3 of the semiconductor vessel 2 by adhesives, in which silver is mixed with an epoxy group material, on the semiconductor vessel 2 composed of covar materials to which lateral leads 1 are attached. |
