发明名称 ELECTRODE TREATMENT DEVICE FOR CHIP PARTS
摘要 PURPOSE:To improve reliability of soldering by providing a cylinder provided with a heater on its upper peripheral part while being thermally insulated from a high boiling point liquid inside a tank so as to perform electrode treatment by charging chip parts into the cylinder from the charging part. CONSTITUTION:An air layer 32 is formed on the upper part of a cylinder 28 and on the peripheral part of a heater 30 by a shielding plate 31 made of stainless steel thermally intercepted from the outside and holding insulation. Chip parts 7 are charged into the upper part 33 inside the cylinder having high temperature by a feeder 36, a line feeder 37 and a rotary chute 38. An Sn-Pb alloy plated film, which is the outermost layer of an electrode is melted in the upper part 33 of the cylinder to fall down to the low temperature part having a temperature gradient for being collected inside a takeoff net 39. This takeoff net 39 is pulled up from a normal temperature liquid surface 35 in order to take out treated chip parts 26. Thereby, the film itself on the outermost layer becomes a clean film containing no impurities so as to improve solder wetting and soldering reliability.
申请公布号 JPH01186603(A) 申请公布日期 1989.07.26
申请号 JP19880005856 申请日期 1988.01.14
申请人 MATSUSHITA ELECTRIC IND CO LTD 发明人 IGARASHI KOZO;SHINDO YASUHIRO;TOYOOKA OSAMU
分类号 H01C17/28;H01G13/00 主分类号 H01C17/28
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