| 摘要 |
PURPOSE:To enable a rear metal to be formed accurately in a short time by controlling the amount of discharge and heating temperature of fusing metal which is a material for rear metal and the rotation speed of a mounting stand. CONSTITUTION:A semiconductor element is mounted on a mounting stand 6 within a storing container 2 with its rear surface facing up and the rotation control of the mounting stand 6 is made by a motor 34. Then, a pump 16 is activated and a fusing metal 10 within the storing container 12 which is provided with a heater 14 is inhaled by an inhaling pipe 18 and is discharged into the storing container from a discharge pipe 20. The fusing metal 10 controls the amount of discharge from the discharge mechanism 16, heating temperature of the heating mechanism 14, and the rotation speed of the mounting stand 6 to allow a certain quantity to be adhered. Thus, the rear metal can be formed to a specified film thickness efficiently in a short time.
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