Directed air management system for cooling multiple heat sinks

摘要

An enclosed mini-plenum is inserted between printed circuit boards to direct cooling air of various amounts into selected areas of the printed circuit board. The mini-plenum provides orifices of varying sizes to direct amounts of cooling airflow to aligned heat sinks on the printed circuit board. Certain orifices may have raised foils or leaves which can further direct selected amounts of airflow through the orifices. This system provides specifically controlled amounts of cooling facilities to printed circuit board areas having different heat dissipation requirements.