| 摘要 |
PURPOSE:To remove an outermost layer adhering on a capacitor element except the upper section of a second foundation layer, and to reduce the lowering of the adhesive strength of an external electrode and trouble at the time of mounting to a printed board by dipping the whole into a chemically inactive liquid at a temperature higher than the melting point of the outermost layer. CONSTITUTION:After deposition of an outermost layer F, an electronic part body is dipped into a chemically inactive liquid at a temperature higher than the melting point of a metal consisting mainly of tin and lead forming the outermost layer F. The outermost layer F is brought to a molten state, and the metal consisting mainly of tin and lead on a capacitor element 1 except a second foundation layer E is removed. The outermost layer adhering on the capacitor element 1 except the upper section of the second foundation layer E is collected onto the second foundation layer E and removed by a surface tension phenomenon. Accordingly, trouble at the time of mounting to a printed board and the lowering of the adhesive strength of an external electrode 2 are reduced. |
