PACKAGED SEMICONDUCTOR CHIP

摘要

A packaged semiconductor chip which effectively dissipates heat and has improved performance. The packaged chip has a plurality of lead frame conductors (38) extending through the encapsulating material (46) which are adhesively joined to the semiconductor chip (34), preferably by means of an alpha barrier (32). The conductors (38) cover a substantial portion of the surface of the chip (34) and thereby serve as conduits for the dissipation of heat from the chip. Wires (58) are bonded to the conductors and extend from the conductors to the terminals (52) on the semiconductor chip. In a preferred embodiment the semiconductor chip terminals (52) are located along a center line of the chip. This allows for short connecting wires (58) which in turn contribute to faster chip response.