| 摘要 |
<p>PURPOSE:To simplify steps, to reduce a size, to proceed the reduction in its thickness, to enhance the conductivity of wiring conductors, and to improve reliability by adhering a plurality of substrates formed in advance with conductors as a multilayer substrate, and forming communication holes penetrating the layers and recess holes in the substrate. CONSTITUTION:Outer layer substrates 12, 13 are adhered through a both-face substrate 11 to form a multilayer substrate, recesses 16, 16... are formed in advance at the substrates 12, 13, and chip components 14 having electrodes 14a, 14b... is buried in the recesses 16, 16. Through holes 23 are penetrated through the three substrates 11, 12, 13, and through holes 28 are opened only at the substrates 12, 13. The substrate 11 is formed in advance with copper foil conductors, inner layer conductors 21, 22 are formed merely by adhering the substrates 12, 13 on both side faces, and outer layer conductors 15 are formed simultaneously upon the formation of through hole connectors 25, 26. Thus, the work of forming the conductor layer may be conducted by a simple work, its conductive performance is improved, and the reliability of a multilayer printed wiring board device is improved.</p> |
