Method of and apparatus for applying polymeric materials to printed circuits.

摘要

A method of and apparatus for applying a curable dry film of polymeric or heat sensitive material to a specific area of one or both surfaces of a printed circuit board (58) to provide protection from stripping and plating operations during the fabrication thereof involves the use of a hot elastomeric pad (50) backed by a rigid surface (52) for stamping or pressing the dry film of protective material to the surface of the printed circuit board. The configuration of the elastomeric pad, (50), the contacting surface (56) thereof, or the support means therefor allow increased conformity of the dry film of polymeric material with irregularities in the surface of a printed circuit board and precludes the formation of air pockets therebetween. The invention is also applicable to semiconductor wafer fabrication.