发明名称 Radiation hardened integrated circuit and method of making the same
摘要 A SOI integrated circuit includes a plurality of islands of single crystalline silicon on a surface of a substrate of an insulating material. Each of the silicon islands contains an electrical component, such as a MOS transistor. A layer of silicon oxide is on the surface of the substrate between the islands and is slightly spaced, at least about 0.1 micrometers, from each of the silicon islands. A line of a conductive material, such as conductive polycrystalline silicon, extends over the silicon islands and between the silicon islands over the silicon oxide layer. The silicon oxide layer isolates the conductive line from the substrate so that any photocurrent generated in the substrate as a result of the integrated circuit being exposed to radiation will not flow through the conductive line to disrupt the circuit.
申请公布号 US4849805(A) 申请公布日期 1989.07.18
申请号 US19870123199 申请日期 1987.11.20
申请人 GENERAL ELECTRIC COMPANY 发明人 HERBERT, JEFFREY C.;SCHLESIER, KENNETH M.
分类号 H01L23/532;H01L27/12 主分类号 H01L23/532
代理机构 代理人
主权项
地址