| 摘要 |
For use in a machine capable of forming integrated circuits or the like on an odd-shaped, odd-sized semiconductor wafer, an improved chuck assembly, for increasing the rotational adjustment capabilities of the chuck assembly and a semiconductor wafer supported thereon. The chuck assembly comprises a mounting ring having a circular configuration formed of a plate and a peripheral wall forming a circular recess extending from a surface of the mounting ring. The chuck assembly also comprises a chuck plate having a circular configuration adapted to be received within the recess of the mounting ring. A lever extends radially from one edge of the chuck plate through an opening in the side wall of the mounting ring. An adjusting bracket is secured to the exterior edge of the mounting ring. Further, a screw is rotatably supported in a threaded aperture in the adjusting bracket and coupled to the lever whereby rotation of the screw will move the lever for adjusting the angular orientation of the chuck plate with respect to the mounting ring.
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