| 摘要 |
A device, utilizing a unique hemispherical cutter to remove a sample of material and to retain the sample of material for retrieval. The cutter is mounted on a chassis which can travel along the interior or exterior of the device to be sampled. The carriage can be maintained in a fixed position relative to the structure being sampled. After positioning of the cutter carrying carriage the cutter blade is pivoted into engagement with the surface. The blade penetrates the surface and removes a sample in a single continuous cut, leaving a shallow dimple. The sample is then retrieved through the return of the cutter and carriage from the device being sampled.
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