| 摘要 |
In a compact heat sink the heat exchange surface consists of metal screen which has been crimped in a wave-like form and then brazed to a metal mounting base. The braze is along the trough of the wave where the mesh contacts the base. The base serves as a carrier for attaching the wire mesh to the object requiring heat transfer. The primary application of this form is heat sinking small electronic package such as "flat-packs" etc. An advantage of the design is that it makes a package which is physically compatible with miniature, low static pressure fans. A secondary form described in the disclosure is an air-to-air heat exchanger in which two crimped screens are attached to the base- one on either side. This application is useful for removing heat from a totally enclosed package. In this case the mounting base is larger than the crimped screen to allow for a flange of clear metal around the perimeter of the screen such that it may be attached to a prepared opening in the sealed package. The photograph attached to the disclosure depicts this type of application.
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