PROCESS FOR FABRICATING MULTI-LEVEL-METAL INTEGRATED CIRCUITS AT HIGH YIELDS

摘要

Inter-layer electrical shorting between layers of conductors of an integrated circuit caused by "hillocks" in the bottom layer is prevented by the use of a double layer photoresist coatings atop the insulating layer that separates the metal layers. The double layer photoresist insures that irregularities in the dielectric layer caused by hillocks in the underlying insulating layer do not cause a break in the photoresist and a subsequent undesired etching of a spurious "via" through the dielectric layer.