发明名称 THERMOCOUPLE ELEMENT
摘要 PURPOSE:To obtain a microminiature thermocouple element with which an impedance coupling can be performed on a high frequency band by a method wherein an amorphous semiconductor, having both high thermoelectric power and high conductivity, and a metal resistor having different polarity of thermoelectric power are combined together. CONSTITUTION:A P type or N type amorphous semiconductor thin film 2 is deposited on a semiinsulative substrate 1 using a glow discharge method, a metal resistive thin film 3 is vapor-deposited in such a manner that it will be contacted to a part of said thin film 2, and this contact part is used as a contact part 5. Then, a multilayer-constructed ohmic contact 4, consisting of Cr of 500Angstrom in thickness and Au of 3,000Angstrom in thickness, is attached to the contact part 6 located on the other end of the thin film 2, and an ohmic electrode 4' consisting of Al, Au, W and the like is coated on the contact part 6' located on the other end of the resistive thin film 3. After having been constituted as above, each contact parts 6 and 6' is used as a cold or hot contact point and electromotive force is generated between the electrodes 4 and 4'. Through these procedures, impedance matching can be simplified and the titled thermocouple element can be suitably used for a power detecting element and the like.
申请公布号 JPS58209174(A) 申请公布日期 1983.12.06
申请号 JP19820091342 申请日期 1982.05.31
申请人 ANRITSU DENKI KK;TAKAHASHI KIYOSHI;KONAGAI MAKOTO 发明人 KOTADO SETSUO;TANIGUCHI AKIRA;TAKAHASHI KIYOSHI;KONAGAI MAKOTO
分类号 H01L35/32;G01R21/04;H01L35/08;H01L35/14 主分类号 H01L35/32
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