发明名称 |
PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME |
摘要 |
<p>There is disclosed a wiring substrate comprising a wiring circuit pattern formed on a metal substrate with an insulating resinous layer interposed therebetween. In this wiring substrate, the insulating resinous layer is formed of a high molecular composition comprising thermosetting 1,2-polybutadiene containing 5 to 30% by weight of a high molecular softening agent such as hydrogenated polybutadiene. A method of manufacturing such a wiring substrate is also disclosed, wherein a light-reflecting pigment is included in the insulating resinous layer for the convenience of the subsequent laser trimming.</p> |
申请公布号 |
DE3663433(D1) |
申请公布日期 |
1989.06.22 |
申请号 |
DE19863663433 |
申请日期 |
1986.03.11 |
申请人 |
KABUSHIKI KAISHA TOSHIBA |
发明人 |
SAITO, MASAYUKI;OODAIRA, HIROSI |
分类号 |
H01C17/065;H01C17/242;H05K1/03;H05K1/05;H05K1/09;H05K1/16;(IPC1-7):H05K1/05;H01C17/24 |
主分类号 |
H01C17/065 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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