发明名称 METALLIZATION FOR PRINTING CONDUCTOR PATTERNS UPON A CERAMIC SUBSTRATE
摘要 A metallization for printing conductor patterns upon a ceramic substrate is disclosed. The metallization is comprised of an admixture of finely divided particles of (1) 60 to 98.5% wt. conductive metal, (2) 20 to 1% wt. inorganic binder, and (3) 20 to 0.5% wt. of a colorant which is a mixture of 5 to 60% wt. of an oxide or oxide precursor of copper, silver or mixtures thereof and 95 to 40% wt. of B2O3 or precursor thereof. The colorant is comprised of no more than 40% wt. of the oxide of silver or 60% wt. of the oxide of copper. The metallization is useful, for example, for making automobile window defoggers.
申请公布号 CA1215863(A) 申请公布日期 1986.12.30
申请号 CA19830425875 申请日期 1983.04.14
申请人 DU PONT (E.I.) DE NEMOURS AND COMPANY 发明人 EUSTICE, ALBERT L.
分类号 H01B5/16;C09K3/18;G11B5/09;H01B1/06;H01B1/16;H05B3/12;H05B3/84;H05K1/09 主分类号 H01B5/16
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