发明名称 CLEANING METHOD FOR PARTING SURFACE OF SEALED MOLDING DIE
摘要 PURPOSE:To remove foreign matters adhered to a parting surface, manufacture a molded product of good quality and enhance the life of a mold by disposing a sheet of resin paper between a top force and a bottom force, clamping the resin paper by the top and bottom forces in a manner to be pinched by the parting surface and taking out the resin paper after unmolding. CONSTITUTION:A sheet of paper 4 is disposed between a top force 1a and a bottom force 1b, both mold opened, and the top force 1a and the bottom force 1b are clamped in a manner to pinch the resin paper 4 with a parting surface 2, when foreign matters 3 such as flashes or the like just adhered to a parting surface 2 between the top force 1a and the bottom force 1b of a sealing mold 1 in the cleaning method of the parting surface of a sealed molding die. The foreign matters 3 are adhered to the resin paper 4, and the resin paper 4 to which foreign matters 3 are adhered after unmolding. The foreign matters 3 can be removed easily by pinching the resin paper 4 between the top force 1a and the bottom force 1b, adhering the foreign matters 3 to the resin paper 4 and removing, and a product of good quality is manufactured to enhance the life of the mold.
申请公布号 JPH01157809(A) 申请公布日期 1989.06.21
申请号 JP19870316655 申请日期 1987.12.15
申请人 MATSUSHITA ELECTRIC WORKS LTD 发明人 TANAHASHI YASUNORI
分类号 B29C33/72 主分类号 B29C33/72
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