发明名称 SURFACE GRINDING METHOD
摘要 PURPOSE:To improve both efficiency and accuracy for surface grinding of a disc shaped work by feeding a cup shaped grinding stone, the rotating shaft of which is parallel with that of a table mentioned later on, to the radial direction against a work coaxially fixed on the rotating table as a whole in such a way that the depth of cut is made when the same reaches the center thereof. CONSTITUTION:Toward a wafer 3 coaxially mounted on a turning table 4, a cup shaped grinding stone 1 which has a rotating shaft in parallel with that of said table while being held movably up and down to the right and left directions, is lowered down in such a way that a machining allowance from the time of grinding start will be (t1) so as to perform the creep feed grinding with a feed provided to the left direction. And when the grinding stone 1 reaches the center of rotation, a depth of cut (t2) is made, then the grinding stone 1 is lifted up after grinding is over. Accordingly, grinding up-to the machining allowance (t1) can be accomplished for a short period of time only by moving the grinding stone to the center of the wafer, and furthermore grinding is performed while the machining allowance (t2) enables a positional relation between the grinding stone 1 and the wafer 3 to be kept constant thereby providing the satisfactory accuracy of surface shape.
申请公布号 JPS62264858(A) 申请公布日期 1987.11.17
申请号 JP19860107562 申请日期 1986.05.13
申请人 HITACHI SEIKO LTD 发明人 KUZE OSAMU
分类号 B24B7/04 主分类号 B24B7/04
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