| 摘要 |
PURPOSE:To increase inspection items at the stage of the inspection of a wafer without spreading a pellet region by forming independent TEG section along the sides of a pallet while also shaping split TEG sections in the vicinity of corner sections. CONSTITUTION:A semiconductor pellet 2 acquired by dividing a wafer 11 is packaged under the state in which it is conducted with an external electrode or outer leads 5. Independent TEG sections 13a, 13b are formed along at least one side of the surface of the semiconductor pellet 2 in such a semiconductor device 1 while split TEG sections 15a-15d are shaped in the vicinity of corner sections. The split TEG sections 15a-15d are conducted electrically with split TEG sections 15a-15d in adjacent other semiconductor pellets under the state of the wafer 11, thus constituting coupled TEG regions 15. Accordingly, the TEG section regions can be enlarged, thus improving the accuracy of the inspection of the wafer, then efficiently manufacturing the semiconductor device having high reliability.
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