| 摘要 |
PURPOSE:To manufacture the module of the semiconductor device, which is small-sized and to an erasable programmable read only memory (EPROM) therein data is easily written, regarding the module of one chip CPU connected in structure which an inverted type package encasing a chip and a leadless chip carrier (LCC) into which the EPROM is encased are superposed. CONSTITUTION:A first package base body 12 is arranged in an inverted type upside down to conventional instances, and the surface of the chip 11 is directed downward in the figure. 14 Represent bonding wires, they connect the pads of the chip 11 and electrodes 15 for wiring, and said electrodes 15 are connected to the pads of the EPROM 13. An extent C' of a cavity 17 can be set to a value larger than conventional instances because wiring connecting the chip 11 and the EPROM 13 is formed regardless of an extent of a cap 18 in such an inverted type package. An EPROMLCC 13 (a second package) is set up under the state in which it is protruded onto the back of the package base body 12, and the whole structure is miniaturized. The availability of a micro-computer is improved because a program for the CPU 11 is easily erased and written by connecting the EPROM 13 of such a form to the CPU 11 through direct attachment. |
