| 摘要 |
<p>A device is disclosed for attaching to or removing modular electronic components from a substrate which is adjustably positioned beneath a heater means delivering a flow of uniformly heated air. The heated air is directed to the sides of the component to melt solder associated with terminals thereon by a series of changable nozzles which can be moved into or out of registry with the component. Vacuum means is also provided for contacting the component to position it on or remove it from the substrate.</p> |
