| 摘要 |
PURPOSE:To obtain a high frequency printed wiring board with less power loss in a high frequency and with high oxidation resistance by using a background metal, etc., so as to coat only to a part to which electronic components on a wiring pattern and applying insulation coating to the other part. CONSTITUTION:Copper is clad to one side or both sides of a dielectric substance and an undesired part is removed by the etching, etc., to form a wiring pattern 2 at least on one side. Then the part 3 connecting an electronic component is used as a background metal and a plating mask used for a conventional wiring board is printed and coated to a part 6 other than the part 3 to apply electrolytic or chemical plating to nickel and later to apply electrolytic or chemical plating to a metal 5 of oxidation resistance such as a gold, etc., or an alloy. Then the plating mask is removed and solder resist as an insulation coating film 7 is coated to the part 6. Through the constitution above, the oxidation resistance of the wiring pattern is improved and since the conductor onto which a high frequency current is concentrated is made of a copper on the surface other than the part 3, the power loss of the high frequency signal to be propagated is less. |
