| 摘要 |
<p>PURPOSE:To make a mounting area small and to make it possible to reduce the concentration of stress at a connecting part due to temperature change and the like after mounting, by performing electrical connection between metal pads on a semiconductor chip and a wiring pattern by compression through a conductive resin, in which conductive particles are included in a hardening resin. CONSTITUTION:A wiring pattern 2 is formed on a wiring board 1 in correspondence with metal pads 4 of a semiconductor chip 5. A hardening resin, in which conductive particles are mixed, is applied on the wiring board corresponding to the metal pads. As an applying shape, anisotropic conductivity is imparted to the conductive resin, and the resin can be applied to a part, which covers the metal pads. After the conductive resin 3 is applied, it is compressed and hardened. When the semiconductor chip cannot be held only with the conductive resin, a layer of hardening resin is provided between the semiconductor chip and the wiring board.</p> |
