MOLDING FOR PACKAGE OF SEMICONDUCTOR AND THE LIKE, MOLDING DEVICE THEREOF AND MOLDING METAL MOLD,申请号JP19870293252-传众专利搜索

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发明名称	MOLDING FOR PACKAGE OF SEMICONDUCTOR AND THE LIKE, MOLDING DEVICE THEREOF AND MOLDING METAL MOLD
摘要
申请公布号	JPH01134955(A)	申请公布日期	1989.05.26
申请号	JP19870293252	申请日期	1987.11.19
申请人	T & K INTERNATL KENKYUSHO:KK	发明人	OSADA MICHIO
分类号	H01L23/08	主分类号	H01L23/08
代理机构		代理人
主权项
地址

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