| 摘要 |
PURPOSE:To prevent an adverse effect upon a pellet due to the splash of a flux, a solder ball and the like by intervening a space between a clip terminal and the pellet with a heat resistant film before applying protective resin to the pellet. CONSTITUTION:A pellet 2 is fixed on a substrate 1 and connected to wiring on the substrate 1. Then, a clip terminal 5 is coupled to the substrate 1 and solder paste 8 is applied thereto. Thereafter, a heat resistant film 6 is provided in a gap between the clip terminal 5 and the pellet 2. A polyimide film, for example, is used as the aforesaid film 6. After laser is irradiated upon the solder paste 8, the heat resistant film 6 is removed and the whole of the substrate 1 is immersed in an organic solvent such as trichlene, thereby removing a flux, a solder ball and the like. |
