| 摘要 |
PURPOSE:To make a rapid bonding available at low cost, by linking a fall motion of a mounting means to that of a pressing means with the fall speed of the mounting means set slower than that of the pressing means, for reducing a shock load at bonding. CONSTITUTION:When a cam 11 rotates round a driving shaft 31, a lod 28 moves right and left through levers 27 and 32, followed by a rotation of a lever 29 which makes a die collet 14 or a chip sticking nozzle 1 perform vertical motion. When a cam 12 rotates round the shaft 31, a lod 23 moves right and left through levers 21 and 41, followed by a rotation of a lever 33 which makes a heat block 5 perform vertical motion through a lod 7. At this time, fall motions of the collet 14 and the block 5 are linked to each other, with the fall speed of the collet 14 set faster than that of the block 5 to decrease a relative speed. This method reduces a shock load at bonding and makes a rapid and low-cost bonding available. |
