| 摘要 |
PURPOSE:To obtain an excellent semiconductor package without push-in operation by positioning a substrate, in which a semiconductor element loaded on the surface is coated previously with a resin sealing medium, onto a liquefied resin sealing medium admitted into a case made of, a metal, an opening of which is directed upward, from the semiconductor-element loading surface side and leaving the substrate to stand and curing the resin sealing medium. CONSTITUTION:A substrate 1 in which a semiconductor element 2 loaded on the surface is covered previously with a resin sealing medium 5 is placed onto a liquefied resin sealing medium 5 in a case 8 made of a metal, an opening of which is directed upward, from the loading surface side and left to stand, thus sinking the substrate into the sealing medium, then creeping the resin sealing medium 5 from the loading surface side to the end face side. The substrate is left to stand, and is not turned upside down and the resin sealing medium is cured under the state. 40-70wt.% fillers are included and not more than 25wt.% particles, mean particle size of which extends over 13mum or less and size distribution of which extends over 4mum or less, and not less than 25wt.% particles, size distribution of which extends over 15-30mum, are contained in the composition of the resin sealing medium, which has fluidity when the medium is left to stand at room temperature and hardly flows on heating curing. |
