| 摘要 |
<p>PURPOSE:To prevent the lowering of the yield of products due to the contamination of a wafer by installing a rolling mechanism angularly turning a semiconductor substrate and positioning the specific peripheral section of the substrate at a fixed position and a conveying mechanism sucking one part of the specific periphery of the positioned substrate in a vacuum and carrying in and out the substrate. CONSTITUTION:When a wafer chuck 1 is rotated and the notch of a disk 5 is revolved up to the position of a sensor 6, light from a projecting section light-shielded by the rotating disk 5 reaches a light-receiving section, and the direction of the rotating disk is sensed by the reaching of light and the revolution of the chuck 1 is stopped. The specific peripheral section 2a of a wafer 2 is sucked by the nose of a load arm 3, and carried onto the chuck 1. The wafer 2 is sucked onto the chuck 1 in a vacuum and turned, a photo-resist is applied and developed at that time, and the wafer chuck is stopped when the notch of the rotating disk 5 reaches at the position of a sensor 7. An unloading arm 4 is rotated, the specific peripheral section 2a of the wafer 2 is sucked under the vacuum, and the wafer is conveyed. Accordingly, the contacting section of a conveying mechanism to the wafer at the time of conveyance is limited to one position.</p> |
