| 摘要 |
PURPOSE:To facilitate the manufacture of a substrate of this design by a method wherein a wiring pattern formed of Al as a main component is formed on an insulating substrate, an insulating film is formed of a high heat-resistant organic resin as a main component, and a wiring conductor pattern is formed making use of a conductive material excellent in solderability. CONSTITUTION:A wiring conductor pattern 2 composed of a wiring conductor film of a required shape is formed on an insulating substrate 1 making use of a conductive material composed of Al as a main component, an interlaminar insulating film 3 composed of an organic insulating film of a required shape is formed employing a high heat-resistant organic resin composed of polyimide as a main component, and these processes are repeated required times, then a wiring conductor pattern 4 composed of a wiring conductor film of a required shape is formed making use of a conductive material excellent in solderability. That is, as the first wiring conductor pattern 2 and the second wiring conductor 4 are made of a Al thin film, these patterns can easily formed into minute ones. On the other hand, a third wiring conductor pattern 6 is made of a Ti/Cu laminated film, wherefore the packaging of mounting components and the connection of external terminals are easily performed through a soldering connection. |
