发明名称 CONNECTION AND MODULE APPLIED TO IT
摘要 <p>PURPOSE: To improve heat radiation from a module by elastically supporting the module in a hole formed in a board. CONSTITUTION: A daughter board 12 has a hole 16 for housing a child board 14. The wall of the hole 16 and the end sections of the board 14 are chamfered at anglesθagainst the flat surfaces of the boards 12 and 14 which are flexible in connection. The anglesθare selected so that the horizontal component of force can form a direct electrical connection between contacts 18 on the child board 14 and contacts 18 on the daughter board 12 and the angles form airtight connection. The airtight connection nearly prevents the formation of precipitates on the contacts 18. Therefore, the heat radiated from the module increases because the flow rate of the air flowing through the boards 12 and 14 increases.</p>
申请公布号 JPH01125998(A) 申请公布日期 1989.05.18
申请号 JP19880180443 申请日期 1988.07.21
申请人 PLESSEY OVERSEAS PLC 发明人 BINSENTO KAATEISU
分类号 H05K3/36;H01R12/50;H05K1/14;H05K3/32;H05K7/10 主分类号 H05K3/36
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