发明名称 PROCESS FOR ENCAPSULATING MICROELECTRONIC CIRCUITS WITH ORGANIC COMPONENTS
摘要 PCT No. PCT/DE85/00473 Sec. 371 Date Jul. 16, 1986 Sec. 102(e) Date Jul. 16, 1986 PCT Filed Nov. 18, 1985 PCT Pub. No. WO86/03056 PCT Pub. Date May 22, 1986.Special absorbers or getters are incorporated in hermetically sealed electronic circuits with organic components, for example, with parylene passivations, silver conductive adhesives, and sealing materials. The getter material, preferably BaAl4, is dispersed as an extremely fine-grained powder in a gas permeable, inert silicone rubber having a composition which varies according to the application. In short- or long-term thermal loading, for example in power hybrid systems, the proposed getters make it possible to intercept any corrosive fission products such as CO, CO2, NO/NO2, and water of reaction to avoid premature aging.
申请公布号 EP0200773(B1) 申请公布日期 1989.05.17
申请号 EP19850905774 申请日期 1985.11.18
申请人 MESSERSCHMITT-BOLKOW-BLOHM GESELLSCHAFT MIT BESCHRANKTER HAFTUNG 发明人 MOLLER, WERNER
分类号 H01L23/26;H01L23/29;H01L23/31 主分类号 H01L23/26
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