Surface treatment method and apparatus thereof

摘要

Treatment baths for surface treatment of semiconductor wafers by dipping thereof into a treatment liquid are arranged in a treatment bath train. One or more selected treatment baths among these treatment baths are constructed to have a plurality of unit treatment vessels. The treatment liquid in these treatment vessels is replaced successively one by one of the unit treatment vessels. The semiconductor wafers are dipped in the treatment liquid contained in that unit treatment vessel that is not being subjected at that moment to the replacement of the treatment liquid.