发明名称 |
Package for packing semiconductor devices and process for producing the same |
摘要 |
In a package comprising a chip mounting base and a cap to be fitted on the base, the base comprises a metal substrate, an electrically insulating ceramic layer formed on the metal substrate, a patterned metal layer formed on the ceramic layer in a selected area thereof, a first mixed layer formed in an area near the interface between the metal substrate and the ceramic layer, and a second mixed layer formed in an area near the interface between the ceramic layer and the metal layer, and the cap comprises a metal substrate, an electrically insulating ceramic layer formed in at least the marginal portion of the side of the metal substrate which faces the base, and a mixed layer that is formed in an area near the interface between the metal substrate and the cermaic layer.
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申请公布号 |
US4831212(A) |
申请公布日期 |
1989.05.16 |
申请号 |
US19870048357 |
申请日期 |
1987.05.11 |
申请人 |
NISSIN ELECTRIC COMPANY, LIMITED |
发明人 |
OGATA, KIYOSHI;ANDO, YASUNORI;KAMIJO, EIJI;MATSUMURA, NORIAKI |
分类号 |
H01L21/48;H01L23/057;H01L23/14 |
主分类号 |
H01L21/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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