| 摘要 |
PURPOSE:To shorten the time required up to the completion of a product after the writing of information by supplying substrate potential (and/or well potential) from the surface of a chip and loading the chip onto the surface to be loaded as an insulating film and a conductive film laminated onto the rear of the chip are left as they are. CONSTITUTION:In a resin seal type semiconductor device 1 with a mask ROM, substrate potential and well potential are fed from the surface of a semiconductor chip 4, and the chip 4 is loaded onto the surface (the surface to be loaded) of a tab section 2A as a layer 40 laminated onto the rear of the chip 4 is left as it is. Consequently, grinding work (back grinding treatment) grinding the layer 40 laminated onto the rear of the semiconductor chip 4 can be removed. Accordingly, the time required up to the completion of products after an information writing process can be shortened. |
