| 摘要 |
PURPOSE: A method for fabricating and assembling a semiconductor heat sink is provided to omit a process for fabricating a base frame having the heat sink regardless of a lead frame where a chip unit is formed, by simultaneously fabricating the chip unit and the heat sink on a single frame so that the number of parts per unit area is increased. CONSTITUTION: A plurality of chip units(110) and heat sinks(150) are fabricated on the first frame(100). A plurality of chip units and heat sinks corresponding to those of the first frame are fabricated on the second frame(200). Mold(115) is formed in a lead(113) of the chip unit formed on the first and second frames. The first and second frames are aligned by a guide hole(170), and the heat sink of the second frame is attached to lower mold of the chip unit of the first frame. The position of the first and second frames is changed, and the second and first frames are re-aligned by the guide hole. The heat sink of the first frame is attached to lower mold of the chip unit of the second frame. After a chip is attached to the upper portion of the heat sinks of the first and second frames, a wire bonding is performed to complete a package. |
