发明名称 INSULATING PASTE
摘要 PURPOSE:To obtain an insulating paste excellent in hot peeling resistance and free from crack formation and void formation, by adding an insulating powder to a mixture of a cycloaliphatic liquid epoxy monomer with a liquid epoxy resin at a specified ratio. CONSTITUTION:At least one cycloaliphatic liquid epoxy monomer (e.g., Celloxide 2021) and at least one liquid epoxy resin (e.g., Epiclon 83 OS) are used in amounts corresponding to a weight ratio of 2/98-40/60. 30-90pts.wt. said resin components are compounded with 10-70pts.wt. at least one insulating powder (e.g., silica) of a thermal conductivity >=10kW.m<-1>. deg.K<-1> (0 deg.C) and free of ionic impurities (e.g., alkali metal ions) and, optionally, a curing catalyst (e.g., imidazole) etc. The resulting mixture is kneaded.
申请公布号 JPH01118563(A) 申请公布日期 1989.05.11
申请号 JP19870274838 申请日期 1987.10.30
申请人 TOSHIBA CHEM CORP 发明人 INABA HIROSHI;KUBOTA YU;OKUNOYAMA TERU
分类号 C08K3/00;C08G59/00;C08K5/15;C08K5/1515;C08L63/00;H01B3/40;H01L21/52 主分类号 C08K3/00
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