| 摘要 |
PURPOSE:To simplify a surface treating process of a printed board, improve the printed substrate in workability, and decrease it in co by a method wherein palladium is made to be plated onto the surface of a cooper wiring as an intermediate layer through an electroless plating method. CONSTITUTION:An electroless plating method is employed for plating of gold and palladium is used as an intermediate layer. That is, an electroless palladium plating is performed onto a glass epoxy printed substrate provided with a copper wiring formed on it using a plating solution. By these processes, gold is made to be plated directly on palladium through a self-catalyzing type electroless plating method without a substitution gold plating. Palladium is used as an intermediate layer, so that a gold plating can be performed stably without decomposing a self-catalyzing type electroless gold plating solution. |
