| 摘要 |
Apparatus for gripping and removing integrated circuits, including four heatable jaws movable into gripping relation with soldered integrated circuit leads. The heatable jaws are mounted to respective leveler plates, each of which is suspended from a base member by a pivotable gripper arm and three flexure arms. Individual air cylinders are selectively actuable to pivot the gripper arms and thereby achieve inward motion and gripping action of the jaws. A second embodiment employs a cam follower mechanism rather than air cylinders to actuate similarly-mounted jaw elements.
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