| 摘要 |
PURPOSE:To eliminate the damage of lower insulating layer and wiring part, by providing an over-etching preventing layer composed of Cu thin film, in a manufacturing method of superconducting multilayer substrate. CONSTITUTION:A lift-off layer 3 is eliminated by lift-off method or the like, and a flat board is obtained. A Cu layer 6 serving as an over etching preventing layer is thinly formed. An alkali-proof resist film 7 is formed and subjected to patterning. The Cu layer 6 is selectively etched. Then a second insulating layer 2' is formed, and subjected to patterning after a lift-off layer 3' and an acid resistant resist layer 4' are formed. By etching an exposed parts of the insulating layer 2' with acid, a desired insulating shape is obtained. Then the Cu layer 6 operates as the over-etching preventing layer, and the damage of the wiring 5 and the insulating layer 2 of a first layer is avoided. |
