发明名称 DEVICE OF CUTTING WAFER
摘要 PURPOSE:To improve operational efficiency by enabling omission of a lapping process, by a method wherein a hone is shifted up to a hone by actuating a feed device, an end face of an ingot is ground with the hone and the ingot is cut into a state of a thin piece with an internal circumferential blade. CONSTITUTION:A hone shaft 62 is pierced through a hole 38A of a rotator 38 coaxially with the hole 38A, coupled movably in an axial direction only through a spline coupling 44 and a cup-shaped hone16 is fitted to the upper end part. When a driving motor 58 is turned, the rotator 38 is turned through a belt 56 and also the hone shaft 62 which is coupled through a spline is turned integrally. Then an ingot 34 is lowered, a motor 76 is turned after that, a feed shaft 70 is shifted upward in an axial direcion through a driving gear 78 and feed gear 74, the hone 16 is shifted up to a grinding position and suspended. When the ingot 34 is moved in the direction A, an end face of the ingot 34 is ground by a grinding part 64 of the hone 16, to begin with, and the ingot 34 is cut off by the inner circumferential blade 14 a little later than the grinding by the hone 16.
申请公布号 JPH01115604(A) 申请公布日期 1989.05.08
申请号 JP19870274537 申请日期 1987.10.29
申请人 TOKYO SEIMITSU CO LTD 发明人 HONDA KATSUO;SAWAFUJI SUSUMU
分类号 H01L21/304;B24B7/22;B24B27/06;B28D1/00;B28D5/00;B28D5/02 主分类号 H01L21/304
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