| 摘要 |
PURPOSE:To enable improved yield as well as improved throughput by aligning the position in optic axis direction of projection optic system of wafer, to a specific reference position, by detecting a slope each shot surface for a specific reference surface before exposure of each shot area, and by compensating for the slope of each shot surface for each exposure. CONSTITUTION:A wafer is carried in, the first printing area is set to the printing position, a light source 4 is allowed to emit tight, light reflected by a wafer 2 which is to be printed is allowed to enter both the first detector 12 and second detector 11 simultaneously, and signal output from each detector is entered into a feedback control system 13. Then, a CPU-1 calculates the amount of position deviation of wafer surface from signal output from the first detector 12 and a CPU-2 calculates the amount of slope of wafer surface from signal output from the second detector 11. Adjusting mechanism in a stage 3 is driven independently and simultaneously by the CPU-1 and CPU-2 until the position and slope of wafer surface enter within an allowable range. |
