| 摘要 |
PURPOSE:To make it possible to dispense with the heat-insulating plate of a base and moreover, to make it possible to set easily the heights of each post and each spacer block by a method wherein the heat of a metal mold or a surface plate supporting the metal mold is insulated with a plurality of the posts of a section capable of compressing and deforming plastically and at the same time, the metal mold or the surface plate is pressed by the posts. CONSTITUTION:In case semiconductor elements are resin-sealed after lead frames 24, each installed with a semiconductor element, are arranged on metal molds 20, the heat of a metal mold 21 or a surface plate 2 supporting the metal mold 21 is insulated with a plurality of posts 25 and 26 constituted in a section capable of compressing and deforming plastically and at the same time, the metal mold 21 or the surface plate 2 is pressed by the posts 25 and 26 and in the pressed state, a resin is poured into the cavity of the metal mold 21. Thereby, the heat-insulating plate of a base becomes unnecessary as the heat of the metal mold or the surface plate is insulated with the posts and moreover, as the deformation of a press at a pressing time is absorbed by the plastic compression and deformation of a plurality of the posts, the lead frames can be pressed evenly without correcting the height of the posts in a gauging manner and the generation of resin burrs on the lead frames can be surely prevented over a long term of time. |
