| 摘要 |
PURPOSE:To enable to simplify the heat treatment for a material to be treated by a method wherein a heater is arranged along the belt conveyor provided in extended manner in a housing, and a part of said belt conveyor passes through a supersonic cleaning device. CONSTITUTION:The semiconductor device 11, transferred to the belt conveyor from a loader 21 by driving the belt conveyor 13, is heated while it is being transferred in a housing 12. On the other hand, as a part of the belt conveyor 13 passes through the supersonic cleaning device 20 successively when it is in operation, the belt is cleaned there and it comes in the housing 12 in a dustfree state. As a result, said belt conveyor 13 is always maintained clean, the penetration of dust into the housing 12 can be prevented and, at the same time, the adhesion of dust to the semiconductor device can also be prevented. Consequently according to this heat treatment device, the heat treatment of the semiconductor device 11 is performed with the movement of the belt conveyor 13, thereby enabling to increase the working efficiency in a high degree. |
