COMPRESSION MOUNT AND ZERO INSERTION FORCE SOCKET FOR IC DEVICES

摘要

COMPRESSION MOUNT AND ZERO INSERTION FORCE SOCKET FOR IC DEVICES In a socket system and method for coupling a pin (114) of an IC (integrated circuit) device (106) to a contact pad (118) of a circuit board (110), a zif opening (204) on a socket (202, 302) asserts substantially zero force as the pin of the IC device is inserted therein. In addition, a compression mount lead (208, 304) on the socket presses against the contact pad of the circuit board. Once inside the zif opening, the pin is coupled to the compression mount lead via forking leads (212) that press against the pin. Thus, substantially zero force is applied on the body of the IC device. Furthermore, top portions of the forking leads contact a top portion of the pin toward the IC device to minimize an electrical path length.